Wiresawing is a method for slicing and cutting silicon wafers, granite, marble and stone. In wiresawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wiresawing is commonly used in the granite and stone cutting industry, silicon wafer production, and other crystal cutting applications. The wiresawing method is particularly effective for semiconductor materials because it cuts crystals with a high yield and small kerf loss.
Washington Mills' group graded silicon carbide grains and precision sized powders are used as a loose abrasive in the cutting of silicon wafers. Washington Mills' silicon carbide grains and powders are manufactured using high quality raw materials and modern processing facilities ensuring stable chemistries, sizing to exact tolerances, and packaged for safe shipping. Silicon Carbide provides for efficient sawing, cutting very thin wafer thus increasing the end users' yields and reducing costs.
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